The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2001
Filed:
Aug. 30, 1999
Kazunori Yamamoto, Tsukuba, JP;
Yasushi Shimada, Tsukuba, JP;
Yasushi Kumashiro, Shimodate, JP;
Teiichi Inada, Shimodate, JP;
Hiroyuki Kuriya, Shimodate, JP;
Aizo Kaneda, Yokohama, JP;
Takeo Tomiyama, Tsukuba, JP;
Yoshihiro Nomura, Ichihara, JP;
Yoichi Hosokawa, Tsukuba, JP;
Hiroshi Kirihara, Ichihara, JP;
Akira Kageyama, Niiza, JP;
Hitachi Chemical Co., Ltd., , JP;
Abstract
The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.