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Ichihara, Japan

Yoshihiro Nomura

This inventor holds 16 USPTO granted patents. Top assignees: Hitachi Chemical Company, Ltd., Other. Active years: 1990-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yoshihiro Nomura. Retrieved from https://idiyas.com/inventor/yoshihiro-nomura

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 16

% Patents Active = 62.5

Average Co-Inventor Count = 4.6

ph-index = 7

Forward Citations = 117(Granted Patents)

Location History:

Ichihara, JP (1990 - 2009)
Oyama, JP (2014)

Company Filing History:

15 out of 1,641

Hitachi Chemical Company, Ltd.

1 out of 834,513

Other

patents

Years Active: 1990-2014

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16 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8765867 - Heat-resistant resin paste and method for producing same (2014-07-01),

2. 7560307 - Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same (2009-07-14),

3. 7449076 - Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame (2008-11-11),

4. 7273654 - Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame (2007-09-25),

5. 7061081 - Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof (2006-06-13),

6. 6621170 - Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film (2003-09-16),

7. 6558500 - Method of producing a lead frame with composite film attached, and use of the lead frame (2003-05-06),

8. 6523446 - Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame (2003-02-25),

9. 6462148 - Adhesive film of quinoline polymer and bismaleimide (2002-10-08),

10. 6445076 - Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same (2002-09-03),

11. 6302991 - Method of producing a lead frame with composite film attached, and use of the lead frame (2001-10-16),

12. 6265782 - Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film (2001-07-24),

13. 5998020 - Composite film and lead frame with composite film attached (1999-12-07),

14. 5212279 - Hot-melt adhesive and its use in polyimide film and printed circuit board (1993-05-18),

15. 5180786 - Impact modifier, thermoplastic resin composition using the same and (1993-01-19),

Title: The Innovative Journey of Yoshihiro Nomura

Introduction: Yoshihiro Nomura, a pioneering inventor hailing from Ichihara, Japan, has made significant contributions to the world of technology through his groundbreaking inventions and patents.

Latest Patents: Nomura's recent patents showcase his expertise in the field of robotics, with a focus on developing advanced AI algorithms for autonomous systems.

Career Highlights: With a career spanning over two decades, Nomura has worked tirelessly to push the boundaries of innovation. His work in the development of cutting-edge medical devices has revolutionized the healthcare industry.

Collaborations: Nomura has collaborated with leading research institutions and universities to further his research in the fields of artificial intelligence and biotechnology. His partnerships have led to the creation of innovative solutions that have improved the lives of many.

Conclusion: Yoshihiro Nomura's passion for innovation and his dedication to creating a positive impact on society through his inventions truly set him apart as a visionary inventor in the world of technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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