The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2008
Filed:
Oct. 04, 2005
Yoshiyuki Tanabe, Chiba, JP;
Yoshihiro Nomura, Ichihara, JP;
Hiroshi Kirihara, Ichihara, JP;
Youichi Hosokawa, Ichihara, JP;
Shinji Iioka, Ichihara, JP;
Satoru Yanagisawa, Ichihara, JP;
Yoshiyuki Tanabe, Chiba, JP;
Yoshihiro Nomura, Ichihara, JP;
Hiroshi Kirihara, Ichihara, JP;
Youichi Hosokawa, Ichihara, JP;
Shinji Iioka, Ichihara, JP;
Satoru Yanagisawa, Ichihara, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.