The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2006
Filed:
Mar. 06, 2001
Yasuhiro Yano, Ichihara, JP;
Hidekazu Matsuura, Ichihara, JP;
Yoshihiro Nomura, Ichihara, JP;
Yoshii Morishita, Hitachi, JP;
Touichi Sakata, Hitachinaka, JP;
Hiroshi Nishizawa, Kitaibaraki, JP;
Toshiaki Tanaka, Tsukuba, JP;
Masaaki Yasuda, Tsukuba, JP;
Aizou Kaneda, Yokohama, JP;
Yasuhiro Yano, Ichihara, JP;
Hidekazu Matsuura, Ichihara, JP;
Yoshihiro Nomura, Ichihara, JP;
Yoshii Morishita, Hitachi, JP;
Touichi Sakata, Hitachinaka, JP;
Hiroshi Nishizawa, Kitaibaraki, JP;
Toshiaki Tanaka, Tsukuba, JP;
Masaaki Yasuda, Tsukuba, JP;
Aizou Kaneda, Yokohama, JP;
Hitachi Chemical Co., Ltd., Tokyo, JP;
Abstract
There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.