The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2002
Filed:
Oct. 07, 1999
Masahiro Suzuki, Hitachi, JP;
Shin Nishimura, Hitachi, JP;
Masao Suzuki, Hitachi, JP;
Akio Takahashi, Hitachi, JP;
Akira Kageyama, Tokyo, JP;
Yoshihiko Honda, Hitachi, JP;
Toshiyasu Kawai, Ichihara, JP;
Shinji Iioka, Ichihara, JP;
Yoshihiro Nomura, Ichihara, JP;
Hitachi Chemical Co., Ltd., Tokyo, JP;
Abstract
A resin composition useful as an adhesive film and insulating material for a multilayer wiring substrate or electronic parts comprises (A) a polymer containing a quinoline ring represented by the formula (1) in the structure such as 6,6′-bis(2-(4-fluorophenyl)-4-phenylquinoline) and 4,4′-(1,1,1,3,3,3-hexafluoro-2,2-propylidene)bisphenol, and (B) a bismaleimide compound represented by the formula (2) such as 2,2-bis((4-maleimidophenoxy)phenyl)propane.