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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7560307 B1

PDFFull Text
Expired
Date of Patent:
Jul. 14, 2009

Filed:

Apr. 14, 2006

Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same

Applicants:

Yasuhiro Yano, Ichihara, JP;

Hidekazu Matsuura, Ichihara, JP;

Yoshihiro Nomura, Ichihara, JP;

Yoshii Morishita, Hitachi, JP;

Touichi Sakata, Hitachinaka, JP;

Hiroshi Nishizawa, Kitaibaraki, JP;

Toshiaki Tanaka, Tsukuba, JP;

Masaaki Yasuda, Tsukuba, JP;

Aizou Kaneda, Yokohama, JP;

Inventors:

Yasuhiro Yano, Ichihara, JP;

Hidekazu Matsuura, Ichihara, JP;

Yoshihiro Nomura, Ichihara, JP;

Yoshii Morishita, Hitachi, JP;

Touichi Sakata, Hitachinaka, JP;

Hiroshi Nishizawa, Kitaibaraki, JP;

Toshiaki Tanaka, Tsukuba, JP;

Masaaki Yasuda, Tsukuba, JP;

Aizou Kaneda, Yokohama, JP;

Assignee:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Attorney:

Antonelli, Terry, Stout & Kraus, LLP.

Primary Examiner:

Luan C Thai

Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 21/48 (2006.01); H01L 21/44 (2006.01); H01L 21/4763 (2006.01); H01L 21/469 (2006.01); H01L 21/31 (2006.01);
U.S. Cl.
CPC ...
Abstract

There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.

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Yano, Yasuhiro. (2009). Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same (U.S. Patent No. 7560307). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7560307

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