The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 1993
Filed:
Oct. 22, 1990
Applicant:
Inventors:
Yoshihiro Nomura, Ichihara, JP;
Takashi Morinaga, Chiba, JP;
Toshiaki Fukushima, Shizuoka, JP;
Hiroshi Minamisawa, Ichihara, JP;
Kazuhito Hanabusa, Fuji, JP;
Assignee:
Hitachi Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G / ; C08G / ; B32B / ; B32B / ;
U.S. Cl.
CPC ...
528184 ; 528125 ; 528128 ; 528170 ; 528171 ; 528172 ; 528173 ; 528174 ; 528176 ; 528179 ; 528185 ; 528188 ; 528220 ; 528226 ; 528229 ; 528310 ; 528331 ; 528332 ; 528350 ; 528351 ; 528352 ; 528353 ; 428458 ; 4284735 ; 428901 ;
Abstract
A hot-melt adhesive comprising a special polyamideimide or polyamide is excellent in heat resistance and adhesive strength and usable for providing substrates for printed circuit boards.
Nomura, Yoshihiro. (1993). Hot-melt adhesive and its use in polyimide film and printed circuit board (U.S. Patent No. 5212279). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5212279
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile