Hiroshi Minamisawa

Title: Hiroshi Minamisawa: Innovator in Adhesive Technologies

Introduction

Hiroshi Minamisawa is a prominent inventor based in Ichihara, Japan. He has made significant contributions to the field of adhesive technologies, particularly in the development of materials used in electronic applications. With a total of 2 patents, his work has had a notable impact on the industry.

Latest Patents

Minamisawa's latest patents include a hot-melt adhesive and its use in polyimide film and printed circuit boards. This innovative adhesive, which comprises a special polyamideimide or polyamide, exhibits excellent heat resistance and adhesive strength, making it suitable for providing substrates for printed circuit boards. Another significant patent is for a solvent-soluble polyimide obtained from an exo-form dicarboxylic acid anhydride with an aromatic diamine, such as 2,2-bis[4-(4-aminophenoxy)phenyl]propane. This polyimide is improved in film-forming properties and transparency, making it particularly suitable for producing orientation controlling films in liquid crystal display devices.

Career Highlights

Hiroshi Minamisawa is currently associated with Hitachi Chemical Company, Ltd., where he continues to innovate and develop new materials. His expertise in adhesive technologies has positioned him as a key figure in the advancement of materials used in electronics.

Collaborations

Some of his notable coworkers include Yoshihiro Nomura and Takashi Morinaga, who have collaborated with him on various projects within the company.

Conclusion

Hiroshi Minamisawa's contributions to adhesive technologies and materials science have established him as a leading inventor in his field. His innovative patents continue to influence the development of advanced electronic applications.