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For the Inventor, By the Inventor

Tsukuba, Japan

Kazunori Yamamoto

This inventor holds 21 USPTO granted patents and 4 EPO patents, primarily in Semiconductor Manufacturing. Top assignees: Hitachi Chemical Company, Ltd., Hitachi, Ltd.. Active years: 1997-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kazunori Yamamoto. Retrieved from https://idiyas.com/inventor/kazunori-yamamoto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 21

% Patents Active = 76.2

 

Average Co-Inventor Count = 7.4

ph-index = 9

Forward Citations = 300(Granted Patents)


Company Filing History:

goldMedal21 out of 1,641 
 
Hitachi Chemical Company, Ltd.
 patents
silverMedal1 out of 42,740 
 
Hitachi, Ltd.
 patents
where one patent can have more than one assignee

Years Active: 1997-2019

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Areas of Expertise:
Semiconductor Device
Multilayer Wiring Board
Conductive Adhesive
Copper Conductor Film
Insulation Material
Liquid Crystal Display
Electronic Circuit
Bonding Film
Adhesive Film
Conductive Substrate
Circuit Board
Manufacturing Method
21 patents (USPTO):Explore Patents
1. 10322572 - Adhesive agent, adhesive material using the same, and method of use thereof (2019-06-18),
2. 9676969 - Composition set, conductive substrate and method of producing the same, and conductive adhesive composition (2017-06-13),
3. 9457406 - Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition (2016-10-04),
4. 8801971 - Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution (2014-08-12),
5. 8040486 - Ink for forming liquid crystal spacer and liquid crystal display device using such ink (2011-10-18),
6. 7700185 - Insulation material, film, circuit board and method of producing them (2010-04-20),
7. 7592250 - Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device (2009-09-22),
8. 7239013 - Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device (2007-07-03),
9. 6889431 - Manufacturing method of electronic circuit including multilayer circuit board (2005-05-10),
10. 6838170 - Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same (2005-01-04),
11. 6673441 - Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same (2004-01-06),
12. 6621170 - Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film (2003-09-16),
13. 6328844 - Filmy adhesive for connecting circuits and circuit board (2001-12-11),
14. 6265782 - Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film (2001-07-24),
15. 6223429 - Method of production of semiconductor device (2001-05-01),

Title: **Kazunori Yamamoto: A Pioneer in Adhesive Innovations**

Introduction

Kazunori Yamamoto is a prominent inventor based in Tsukuba, Japan, with an impressive portfolio of 21 patents. His work primarily focuses on advancements in adhesive technologies, demonstrating his significant contributions to this field.

Latest Patents

Yamamoto's recent innovations include two noteworthy patents: the first is an adhesive agent that comprises a condensation resin with structural units derived from polycondensing a polymerizable monomer. This includes a monomer with two or more carboxyl groups and another monomer with two or more amino groups. The agent meets specific structural criteria, enhancing its utility in various applications. The second patent details a composition set that includes a conductor layer-forming composition and a conductive adhesive composition. This innovative formulation comprises a dispersing medium, inorganic particles of metallic oxides, a binder, and conductive particles ranging from 1 nm to 3000 nm in size, showcasing his dedication to creating versatile and effective adhesive solutions.

Career Highlights

Kazunori Yamamoto has had a distinguished career in the chemical industry, having worked with well-known companies such as Hitachi Chemical Company, Ltd. and Hitachi, Ltd. His expertise in adhesive materials has made him a valuable asset to these organizations, where he has played a key role in driving technological advancements.

Collaborations

Throughout his career, Yamamoto has collaborated with fellow experts such as Yasushi Kumashiro and Yasushi Shimada. These partnerships have further enhanced his innovative capabilities, allowing him to explore new avenues in adhesive technology and contribute to the development of groundbreaking products.

Conclusion

Kazunori Yamamoto’s contributions to adhesive innovation are marked by his extensive patent portfolio and collaborations with prominent industry experts. As he continues to explore the potential of adhesive materials, his work is likely to inspire future innovations in this essential field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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