The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2001
Filed:
Aug. 24, 1999
Itsuo Watanabe, Shimodate, JP;
Kenzo Takemura, Yuki, JP;
Osamu Watanabe, Tsukuba, JP;
Naoyuki Shiozawa, Tochigi-ken, JP;
Akira Nagai, Tsukuba, JP;
Kazuyoshi Kojima, Tsukuba, JP;
Toshiaki Tanaka, Tsukuba, JP;
Kazunori Yamamoto, Tsukuba, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
A heat-active adhesive for a connecting circuit which is used for electrically connecting circuit electrodes facing each other in the pressing direction by heating and pressing the electrodes. The adhesive has an elastic modulus of 100-2,000 MPa at 40° C. after adhesion. The adhesive can contain at least an epoxy resin, acrylic rubber, and a latent curing agent. An acrylic rubber having a glycidryl ether group as a molecule is preferably used as the acrylic rubber.