Itsuo Watanabe

This inventor holds 38 USPTO granted patents and 4 published patent applications and 1 EPO patent, primarily in Circuit Connection Materials. Top assignee: Hitachi Chemical Company, Ltd.. Active years: 1995-2013.

USPTO Granted Patents = 38 (Patent Applications = 4)

% Patents Active = 36.8

EPO Patents = 1 (Patent Applications = 2)

Average Co-Inventor Count = 5.8

ph-index = 13

Forward Citations = 524(Granted Patents)

Location History:

Simodate, JP (2000 - 2002)
Ibaraki-ken, JP (2009 - 2011)
Shimodate, JP (1995 - 2012)
Ibaraki, JP (2004 - 2012)
Chikusei, JP (2012 - 2013)

Company Filing History:

38 out of 1,641

Hitachi Chemical Company, Ltd.

patents

Years Active: 1995-2013

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Areas of Expertise:

Circuit Connecting Material

Adhesive

Wiring Terminal

Circuit Board

Production Process

Electronic Circuit

Wiring Structure

Semiconductor Chips

Connection Structure

Repairing Method

Information Recording Medium

Polymeric Coating

38 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8501045 - Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same (2013-08-06),

2. 8273458 - Adhesive for bonding circuit members, circuit board and process for its production (2012-09-25),

3. 8273457 - Adhesive for bonding circuit members, circuit board and process for its production (2012-09-25),

4. 8252419 - Adhesive for bonding circuit members, circuit board and process for its production (2012-08-28),

5. 8202622 - Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same (2012-06-19),

6. 8142605 - Circuit-connecting material and circuit terminal connected structure and connecting method (2012-03-27),

7. 8120189 - Wiring terminal-connecting adhesive (2012-02-21),

8. 8115322 - Adhesive, method of connecting wiring terminals and wiring structure (2012-02-14),

9. 8043709 - Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same (2011-10-25),

10. 7968196 - Circuit-connecting material and circuit terminal connected structure and connecting method (2011-06-28),

11. 7967943 - Circuit-connecting material and circuit terminal connected structure and connecting method (2011-06-28),

12. 7879956 - Circuit-connecting material and circuit terminal connected structure and connecting method (2011-02-01),

13. 7879445 - Adhesive for bonding circuit members, circuit board and process for its production (2011-02-01),

14. 7785708 - Adhesive film for circuit connection, and circuit connection structure (2010-08-31),

15. 7777335 - Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles (2010-08-17),

Title: The Innovative Journey of Itsuo Watanabe

Introduction: Itsuo Watanabe, a pioneering inventor hailing from Shimodate, Japan, has made significant contributions to the world of innovations with his groundbreaking ideas and inventions.

Latest Patents: Itsuo Watanabe's latest patents focus on advancements in robotics and artificial intelligence, showcasing his commitment to pushing the boundaries of technology.

Career Highlights: Throughout his illustrious career, Itsuo Watanabe has been recognized for his inventive spirit and problem-solving skills. His inventions have revolutionized various industries, from healthcare to manufacturing.

Collaborations: Itsuo Watanabe has collaborated with leading research institutions and universities to further develop his inventions. His partnerships have led to the creation of cutting-edge technologies that have had a lasting impact on society.

Conclusion: Itsuo Watanabe's passion for innovation and dedication to creating solutions for the future have solidified his position as a respected inventor in the global community. His work continues to inspire the next generation of inventors to think outside the box and pursue their creative visions.