The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2012
Filed:
Jun. 22, 2011
Applicants:
Itsuo Watanabe, Shimodate, JP;
Kenzo Takemura, Yuki, JP;
Akira Nagai, Tsukuba, JP;
Kazuhiro Isaka, Tsukuba, JP;
Osamu Watanabe, Tsukuba, JP;
Kazuyoshi Kojima, Tsukuba, JP;
Inventors:
Itsuo Watanabe, Shimodate, JP;
Kenzo Takemura, Yuki, JP;
Akira Nagai, Tsukuba, JP;
Kazuhiro Isaka, Tsukuba, JP;
Osamu Watanabe, Tsukuba, JP;
Kazuyoshi Kojima, Tsukuba, JP;
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/38 (2006.01);
U.S. Cl.
CPC ...
Abstract
An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.