Tsukuba, Japan

Osamu Watanabe


Average Co-Inventor Count = 7.0

ph-index = 6

Forward Citations = 172(Granted Patents)


Location History:

  • Hitachi, JP (1995 - 1996)
  • Simodate, JP (2000 - 2002)
  • Tsukuba, JP (2001 - 2012)

Company Filing History:


Years Active: 1995-2012

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12 patents (USPTO):Explore Patents

Title: Osamu Watanabe: Innovator in Semiconductor Adhesives

Introduction

Osamu Watanabe is a prominent inventor based in Tsukuba, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the development of adhesives used in circuit board manufacturing. With a total of 12 patents to his name, Watanabe's work has had a substantial impact on the industry.

Latest Patents

Watanabe's latest patents include an innovative adhesive for bonding circuit members and a process for its production. This adhesive is designed to bond and secure semiconductor chips to circuit boards while ensuring electrical connectivity between the electrodes. The formulation includes an adhesive resin composition combined with an inorganic filler, which is present in an amount ranging from 10 to 200 parts by weight relative to 100 parts by weight of the adhesive resin composition.

Career Highlights

Watanabe is currently employed at Hitachi Chemical Company, Ltd., where he continues to advance his research and development efforts. His work has been instrumental in enhancing the reliability and performance of semiconductor devices.

Collaborations

Some of Watanabe's notable coworkers include Itsuo Watanabe and Kenzo Takemura, who have collaborated with him on various projects within the semiconductor field.

Conclusion

Osamu Watanabe's contributions to semiconductor adhesives exemplify the importance of innovation in technology. His patents reflect a commitment to improving the efficiency and effectiveness of electronic components.

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