The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2001
Filed:
Aug. 30, 1999
Kenzo Takemura, Yuki, JP;
Itsuo Watanabe, Shimodate, JP;
Akira Nagai, Tsukuba, JP;
Osamu Watanabe, Tsukuba, JP;
Kazuyoshi Kojima, Tsukuba, JP;
Akishi Nakaso, Oyama, JP;
Kazunori Yamamoto, Tsukuba, JP;
Yoshiyuki Tsuru, Shimodate, JP;
Teiichi Inada, Shimodate, JP;
Yasushi Shimada, Tsukuba, JP;
Abstract
In regard to a packaging substrate on which a semiconductor chip is mounted, the surface copper foil of a double-sided copper-clad glass epoxy resin laminated sheet is subjected to circuit formation and inner-layer bonding, then an epoxy resin adhesive film with copper foil is bonded to the surface of the inner-layer circuit by press lamination, and a through hole is formed through the sheet, followed by electroless copper plating, outer-layer circuit formation by the subtractive process, and solder coating to obtain the packaging substrate. The bump electrode of the semiconductor chip and the packaging substrate are connected through an adhesive film.