Yuki, Japan

Kenzo Takemura


Average Co-Inventor Count = 7.5

ph-index = 6

Forward Citations = 166(Granted Patents)


Location History:

  • Yuuki, JP (2000 - 2002)
  • Yuki, JP (2001 - 2012)

Company Filing History:


Years Active: 2000-2012

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10 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Kenzo Takemura

Introduction

Kenzo Takemura, a renowned inventor based in Yuki, Japan, has made significant contributions to the field of electronics through his work, particularly in the development of advanced adhesives for circuit board applications. With a total of 10 patents to his name, Takemura's innovations have been pivotal in enhancing the efficiency and reliability of electronic components.

Latest Patents

Among his most notable patents are those related to adhesives for bonding circuit members. One of his latest inventions focuses on a specialized adhesive designed for securely bonding and electrically connecting semiconductor chips to circuit boards. This adhesive composition includes an adhesive resin and an inorganic filler contained in precise proportions, specifically between 10 to 200 parts by weight for every 100 parts by weight of the adhesive resin composition. This innovation is crucial for ensuring robust electrical connections in modern electronic devices.

Career Highlights

Kenzo Takemura currently works at Hitachi Chemical Company, Ltd., where he has dedicated a significant part of his career to advancing adhesive technologies. His work has not only improved the bonding processes within semiconductor applications but also contributed to the overall quality and performance of electronic products.

Collaborations

Throughout his career, Takemura has collaborated with various talented professionals, including coworkers Itsuo Watanabe and Osamu Watanabe. These collaborations have fostered an environment of innovation and creativity, leading to groundbreaking advancements in the field of adhesive technology.

Conclusion

Kenzo Takemura's inventive spirit and dedication to improving adhesive solutions for electronic components highlight his essential role in the industry. His contributions continue to impact the future of electronics, making him a notable figure in the realm of innovation and invention.

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