Hitachi Chemical Company, Ltd.

Kenzo Takemura

Itsuo Watanabe

Kazuyoshi Kojima

Osamu Watanabe

Akira Nagai

Kazuhiro Isaka

Naoyuki Shiozawa

Kazunori Yamamoto

Tomohisa Ohta

Toshiaki Tanaka

Isao Tsukagoshi

Kouji Kobayashi

Yukihisa Hirosawa

Hiroshi Matsuoka

Fumio Inoue

Akishi Nakaso

Teiichi Inada

Yoshiyuki Tsuru

Masaaki Yasuda

Yasushi Shimada

Yoshiaki Tsubomatsu

Aizou Kaneda

Toshio Yamazaki

Hiroto Ohata

An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

Adhesive for bonding circuit members, circuit board and process for its production

An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing 100 parts by weight of an adhesive resin composition and 10 to 200 parts by weight of an adhesive resin composition and 10 to 200 parts by weight of an inorganic filler, a circuit board in which the circuit members are bonded together with the adhesive, and a method of producing the circuit board.

Adhesive for bonding circuit members, circuit board, and method of producing the same

A connection sheet which firmly bonds electrodes that face each other together by interposing the connection sheet between the electrodes. The connection sheet comprises a first adhesive layer containing a first adhesive having an insulating property and a second adhesive layer containing a second adhesive having an insulating property and a conductive material and placed at least on one side of the first adhesive layer. At the same time of electrode connection, the second adhesive molten has a viscosity equal to or lower than that of the first adhesive when molten. When the electrodes are connected with this structure, the conductive material contained in the second adhesive layer is embedded in the first adhesive layer having relatively high melting viscosity, and part of the conductive material is trapped on the electrodes to be connected in contact therewith. Accordingly, the conductive material can be securely held between the electrodes. Further, since the region between adjacent protruding electrodes contains no air bubbles, connection reliability and excellent moisture resistance is ensured.

Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet

A heat-active adhesive for a connecting circuit which is used for electrically connecting circuit electrodes facing each other in the pressing direction by heating and pressing the electrodes. The adhesive has an elastic modulus of 100-2,000 MPa at 40&deg; C. after adhesion. The adhesive can contain at least an epoxy resin, acrylic rubber, and a latent curing agent. An acrylic rubber having a glycidryl ether group as a molecule is preferably used as the acrylic rubber.

Filmy adhesive for connecting circuits and circuit board

Method of production of semiconductor device

In regard to a packaging substrate on which a semiconductor chip is mounted, the surface copper foil of a double-sided copper-clad glass epoxy resin laminated sheet is subjected to circuit formation and inner-layer bonding, then an epoxy resin adhesive film with copper foil is bonded to the surface of the inner-layer circuit by press lamination, and a through hole is formed through the sheet, followed by electroless copper plating, outer-layer circuit formation by the subtractive process, and solder coating to obtain the packaging substrate. The bump electrode of the semiconductor chip and the packaging substrate are connected through an adhesive film.

Electronic component parts device

A connection sheet which firmly bonds electrodes that face each other together by interposing the connection sheet between the electrodes. The connection sheet comprises a first adhesive layer containing a first adhesive having an insulating property and a second adhesive layer placed at least on one side of the first adhesive layer and containing a second adhesive having an insulating property and a conductive material, wherein at the time of electrode connection, the second adhesive molten has a viscosity equal to or lower than that of the first adhesive when molten. When the electrodes are connected with this structure, the conductive material contained in the second adhesive layer is embedded in the first adhesive layer having relatively high melting viscosity, and part of the conductive material is trapped on the electrodes to be connected in contact therewith. Accordingly, the conductive material can be securely held between the electrodes. Further, since the region between adjacent protruding electrodes contains no air bubbles, connection reliability and excellent moisture resistance is ensured.

Connection sheet and electrode connection structure for electrically

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Yuki, Japan

Kenzo Takemura