Tsukuba, Japan

Kazuyoshi Kojima

USPTO Granted Patents = 14 

 

Average Co-Inventor Count = 6.2

ph-index = 7

Forward Citations = 179(Granted Patents)


Location History:

  • Simodate, JP (2000 - 2002)
  • Tsukuba, JP (2001 - 2012)
  • Ibaraki, JP (2011 - 2012)
  • Chikusei, JP (2012 - 2013)

Company Filing History:


Years Active: 2000-2013

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14 patents (USPTO):Explore Patents

Title: Kazuyoshi Kojima: Innovator in Circuit Connecting Materials

Introduction

Kazuyoshi Kojima is a prominent inventor based in Tsukuba, Japan. He has made significant contributions to the field of circuit connecting materials, holding a total of 14 patents. His work focuses on enhancing the efficiency and reliability of electronic components.

Latest Patents

Kojima's latest patents include innovative technologies such as a circuit connecting material, a film-form circuit connecting material, and a circuit member connecting structure. The circuit connecting material is designed for the mutual connection of circuit members, featuring electrodes and insulating layers formed adjacent to each other on the surface of a board. This material contains a bonding agent composition and conductive particles with specific properties, ensuring optimal performance. Additionally, he has developed an adhesive for bonding semiconductor chips to circuit boards, which facilitates electrical connections between the electrodes.

Career Highlights

Kojima is currently associated with Hitachi Chemical Company, Ltd., where he continues to advance his research and development efforts. His work has been instrumental in improving the manufacturing processes and materials used in electronic devices.

Collaborations

Kojima has collaborated with notable colleagues, including Itsuo Watanabe and Kenzo Takemura, to further enhance the innovations in circuit connecting technologies.

Conclusion

Kazuyoshi Kojima's contributions to the field of circuit connecting materials have established him as a key figure in the electronics industry. His innovative patents and ongoing research continue to shape the future of electronic component manufacturing.

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