Hitachi Chemical Company, Ltd.

Kazuyoshi Kojima

Itsuo Watanabe

Osamu Watanabe

Kenzo Takemura

Akira Nagai

Kouji Kobayashi

Kazuhiro Isaka

Motohiro Arifuku

Naoyuki Shiozawa

Kazunori Yamamoto

Tomohisa Ohta

Yasushi Gotou

Toshiaki Tanaka

Isao Tsukagoshi

Yukihisa Hirosawa

Hiroshi Matsuoka

Fumio Inoue

Akishi Nakaso

Teiichi Inada

Yoshiyuki Tsuru

Masaaki Yasuda

Yasushi Shimada

Aizou Kaneda

Yoshiaki Tsubomatsu

Toshio Yamazaki

Hiroto Ohata

The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 &#x3bc;m or greater but less than 10 &#x3bc;m and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40&#xb0; C. and a mean coefficient of thermal expansion of 30 to 200 ppm/&#xb0; C. at from 25&#xb0; C. to 100&#xb0; C. when subjected to the curing treatment.

Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same

An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

Adhesive for bonding circuit members, circuit board and process for its production

The invention provides a circuit connecting method that can satisfactorily reduce connection resistance between circuit electrodes electrically connected via an anisotropic conductive film for circuit connection. The circuit connecting method comprises a step of preparing a circuit memberhaving circuit electrodesformed on a glass substrate, a step of preparing a flexible wiring boardhaving circuit electrodesformed on a baseand provided with a solder resistat the sections of the circuit electrodesother than the sections that are connected to the circuit electrodes, and a step of bonding the circuit memberto the flexible wiring boardvia an anisotropic conductive film for circuit connectionso that part of the anisotropic conductive film for circuit connectionoverlaps with part of the solder resist. The thickness hof the anisotropic conductive film for circuit connectionis no greater than the total of the height hof the circuit electrodesand the height hof the circuit electrodes

Circuit connecting method

Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same

An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing 100 parts by weight of an adhesive resin composition and 10 to 200 parts by weight of an adhesive resin composition and 10 to 200 parts by weight of an inorganic filler, a circuit board in which the circuit members are bonded together with the adhesive, and a method of producing the circuit board.

Adhesive for bonding circuit members, circuit board, and method of producing the same

A connection sheet which firmly bonds electrodes that face each other together by interposing the connection sheet between the electrodes. The connection sheet comprises a first adhesive layer containing a first adhesive having an insulating property and a second adhesive layer containing a second adhesive having an insulating property and a conductive material and placed at least on one side of the first adhesive layer. At the same time of electrode connection, the second adhesive molten has a viscosity equal to or lower than that of the first adhesive when molten. When the electrodes are connected with this structure, the conductive material contained in the second adhesive layer is embedded in the first adhesive layer having relatively high melting viscosity, and part of the conductive material is trapped on the electrodes to be connected in contact therewith. Accordingly, the conductive material can be securely held between the electrodes. Further, since the region between adjacent protruding electrodes contains no air bubbles, connection reliability and excellent moisture resistance is ensured.

Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet

A heat-active adhesive for a connecting circuit which is used for electrically connecting circuit electrodes facing each other in the pressing direction by heating and pressing the electrodes. The adhesive has an elastic modulus of 100-2,000 MPa at 40&deg; C. after adhesion. The adhesive can contain at least an epoxy resin, acrylic rubber, and a latent curing agent. An acrylic rubber having a glycidryl ether group as a molecule is preferably used as the acrylic rubber.

Filmy adhesive for connecting circuits and circuit board

Method of production of semiconductor device

In regard to a packaging substrate on which a semiconductor chip is mounted, the surface copper foil of a double-sided copper-clad glass epoxy resin laminated sheet is subjected to circuit formation and inner-layer bonding, then an epoxy resin adhesive film with copper foil is bonded to the surface of the inner-layer circuit by press lamination, and a through hole is formed through the sheet, followed by electroless copper plating, outer-layer circuit formation by the subtractive process, and solder coating to obtain the packaging substrate. The bump electrode of the semiconductor chip and the packaging substrate are connected through an adhesive film.

Electronic component parts device

A connection sheet which firmly bonds electrodes that face each other together by interposing the connection sheet between the electrodes. The connection sheet comprises a first adhesive layer containing a first adhesive having an insulating property and a second adhesive layer placed at least on one side of the first adhesive layer and containing a second adhesive having an insulating property and a conductive material, wherein at the time of electrode connection, the second adhesive molten has a viscosity equal to or lower than that of the first adhesive when molten. When the electrodes are connected with this structure, the conductive material contained in the second adhesive layer is embedded in the first adhesive layer having relatively high melting viscosity, and part of the conductive material is trapped on the electrodes to be connected in contact therewith. Accordingly, the conductive material can be securely held between the electrodes. Further, since the region between adjacent protruding electrodes contains no air bubbles, connection reliability and excellent moisture resistance is ensured.

Connection sheet and electrode connection structure for electrically

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Tsukuba, Japan

Kazuyoshi Kojima