The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2012
Filed:
Sep. 10, 2009
Motohiro Arifuku, Chikusei, JP;
Itsuo Watanabe, Chikusei, JP;
Yasushi Gotou, Chikusei, JP;
Kouji Kobayashi, Chikusei, JP;
Kazuyoshi Kojima, Chikusei, JP;
Motohiro Arifuku, Chikusei, JP;
Itsuo Watanabe, Chikusei, JP;
Yasushi Gotou, Chikusei, JP;
Kouji Kobayashi, Chikusei, JP;
Kazuyoshi Kojima, Chikusei, JP;
Hitachi Chemical Co., Ltd., Tokyo, JP;
Abstract
The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.