Shimodate, Japan

Yasushi Gotou

USPTO Granted Patents = 6 

 

Average Co-Inventor Count = 4.4

ph-index = 2

Forward Citations = 19(Granted Patents)


Location History:

  • Shimodate, JP (2007 - 2010)
  • Ibaraki, JP (2011)
  • Chikusei, JP (2012 - 2013)

Company Filing History:


Years Active: 2007-2013

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6 patents (USPTO):Explore Patents

Title: Innovations of Yasushi Gotou

Introduction

Yasushi Gotou is a prominent inventor based in Shimodate, Japan. He has made significant contributions to the field of circuit connecting materials, holding a total of six patents. His work focuses on enhancing the efficiency and reliability of electronic components.

Latest Patents

Among his latest patents are innovations such as a circuit connecting material, a film-form circuit connecting material using the same, and a circuit member connecting structure along with its manufacturing method. These inventions are designed for the mutual connection of circuit members, where electrodes and insulating layers are formed adjacent to each other on the surface of a board. The circuit connecting material includes a bonding agent composition and conductive particles with a mean particle size of 1 µm or greater but less than 10 µm. It also exhibits a hardness ranging from 1.961 to 6.865 GPa, a storage elastic modulus of 0.5 to 3 GPa at 40°C, and a mean coefficient of thermal expansion of 30 to 200 ppm/°C from 25°C to 100°C when subjected to curing treatment.

Career Highlights

Yasushi Gotou is currently associated with Hitachi Chemical Company, Ltd., where he continues to innovate in the field of electronic materials. His expertise has led to advancements that are crucial for modern electronic devices.

Collaborations

He has collaborated with notable coworkers such as Motohiro Arifuku and Itsuo Watanabe, contributing to the development of cutting-edge technologies in their field.

Conclusion

Yasushi Gotou's contributions to circuit connecting materials exemplify the importance of innovation in electronics. His patents reflect a commitment to improving the functionality and performance of electronic components.

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