Hitachi Chemical Company, Ltd.

Yasushi Gotou

Yasuo Miyadera

Itsuo Watanabe

Masami Yusa

Motohiro Arifuku

Isao Tsukagoshi

Kouji Kobayashi

Kazuyoshi Kojima

The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 &#x3bc;m or greater but less than 10 &#x3bc;m and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40&#xb0; C. and a mean coefficient of thermal expansion of 30 to 200 ppm/&#xb0; C. at from 25&#xb0; C. to 100&#xb0; C. when subjected to the curing treatment.

Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same

Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same

The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I):  

Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure

An adhesive film including a reactive adhesive capable of curing by heating or light irradiation and a polyphthalide represented by the formula I: wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, Rrepresents an alkyl group, a Fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of Ris 0 to 4, X represents O or N&#x2014;R, provided that Rrepresents one of the following groups, Y represents SOor CO and n represents a number of repeating units in the polymer. The adhesive film can be used to connect, e.g., electrodes of a semiconductor chip to electrodes of a wiring board. The polyphthalide can be used to surface-treat, e.g., electrodes of a wiring board.

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Shimodate, Japan

Yasushi Gotou