Hitachi Chemical Company, Ltd.

Itsuo Watanabe

Motohiro Arifuku

Tohru Fujinawa

Kazuyoshi Kojima

Kouji Kobayashi

Atsushi Kuwano

Osamu Watanabe

Kenzo Takemura

Houko Kanazawa

Akira Nagai

Yasushi Gotoh

Kazuhiro Isaka

Kouji Motomura

Naoyuki Shiozawa

Kazunori Yamamoto

Isao Tsukagoshi

Tomohisa Ohta

Yoshiaki Tsubomatsu

Yasushi Gotou

Atushi Kuwano

Toshiaki Tanaka

Seiji Tai

Masami Yusa

Akishi Nakaso

Satoyuki Nomura

Yoshiyuki Tsuru

Hidehiro Nakamura

Naoki Fukutomi

Hiroshi Ono

Naoki Fukushima

Hajime Nakayama

Nobuaki Takane

Takashi Tatsuzawa

Kouichi Kaitou

Masahiko Itabashi

Hoko Kanazawa

Yukihisa Hirosawa

Hiroshi Matsuoka

Masanori Nakamura

Mitsuo Yamada

Jun Taketatsu

Masahide Kume

Fumio Inoue

Naoyuki Urasaki

Teiichi Inada

Masaaki Yasuda

Yasushi Shimada

Aizou Kaneda

Toshio Yamazaki

Hiroshi Yasuda

Yasusi Simada

Hiroto Ohata

The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 &#x3bc;m or greater but less than 10 &#x3bc;m and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40&#xb0; C. and a mean coefficient of thermal expansion of 30 to 200 ppm/&#xb0; C. at from 25&#xb0; C. to 100&#xb0; C. when subjected to the curing treatment.

Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same

An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

Adhesive for bonding circuit members, circuit board and process for its production

A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Circuit-connecting material and circuit terminal connected structure and connecting method

A wiring structure having a wiring-terminal-connection adhesive that includes a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles.

Wiring terminal-connecting adhesive

This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.

Adhesive, method of connecting wiring terminals and wiring structure

Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same

A circuit-connecting material interposed between mutually-facing circuit electrodes, and electrically connecting the electrodes, either by direct contact, or via conductive particles present in the material. The circuit-connecting material features: (1) a curing agent capable of generating free radicals upon heating; (2) a radical-polymerizable substance, and two or more microscopically separated phases. The two or more microscopically separated phases include an elastomer phase of carboxyl-group-containing elastomer and a phenoxy resin phase of a phenoxy resin having a weight average molecular weight of 10,000 or more.

A circuit-connecting material for interposing between circuit electrodes facing each other and electrically connecting the electrodes, after curing by heat and pressure, either by direct contact or via conductive particles present in the material. The circuit-connecting material features the following essential components: (1) a curing agent capable of generating free radicals upon heating, (2) a phenoxy resin having a weight average molecular weight of 10,000 or more, and that is chemically modified by a carboxyl-group-containing elastomer, and (3) a radical-polymerizable substance.

The present invention provides an adhesive film for circuit connection which is to be interposed between circuit electrodes facing each other and used for electrically connecting the circuit electrodes to each other, which comprises a curing agent to generate free radicals with heating, a radically polymerizable substance, and a film-forming polymer, and in which a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m.

Adhesive film for circuit connection, and circuit connection structure

Growing community of inventors

Shimodate, Japan

Itsuo Watanabe