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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9676969 B1

PDFFull Text
Date of Patent:
Jun. 13, 2017

Filed:

Jul. 30, 2012

Composition set, conductive substrate and method of producing the same, and conductive adhesive composition

Applicants:

Hideo Nakako, Tsukuba, JP;

Kazunori Yamamoto, Tsukuba, JP;

Yasushi Kumashiro, Chikusei, JP;

Shunya Yokosawa, Tsukuba, JP;

Takaaki Noudou, Chikusei, JP;

Maki Inada, Tsukuba, JP;

Kyoko Kuroda, Chikusei, JP;

Inventors:

Hideo Nakako, Tsukuba, JP;

Kazunori Yamamoto, Tsukuba, JP;

Yasushi Kumashiro, Chikusei, JP;

Shunya Yokosawa, Tsukuba, JP;

Takaaki Noudou, Chikusei, JP;

Maki Inada, Tsukuba, JP;

Kyoko Kuroda, Chikusei, JP;

Assignee:

HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, LLP

Primary Examiner:

Mark Kopec

Int. Cl.
CPC ...
H01B 1/00 (2006.01); B05D 5/12 (2006.01); C09J 9/00 (2006.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); H01B 1/22 (2006.01); H05K 3/38 (2006.01); C09J 7/02 (2006.01); H01B 13/00 (2006.01); H05K 3/10 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01); H05K 1/03 (2006.01); C08K 3/08 (2006.01); C08K 3/22 (2006.01); C08K 7/18 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); B05D 5/12 (2013.01); C09J 7/0292 (2013.01); C09J 11/04 (2013.01); H01B 1/22 (2013.01); H01B 13/00 (2013.01); H05K 3/105 (2013.01); H05K 3/1208 (2013.01); H05K 3/38 (2013.01); C08K 3/08 (2013.01); C08K 3/22 (2013.01); C08K 7/18 (2013.01); C09J 2201/602 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); H05K 1/0306 (2013.01); H05K 1/095 (2013.01); H05K 1/097 (2013.01); H05K 3/1283 (2013.01); H05K 2203/1157 (2013.01); Y10T 428/24967 (2015.01); Y10T 428/25 (2015.01);
Abstract

The invention provides a composition set comprising: a conductor layer-forming composition comprising a dispersing medium and inorganic particles comprising a metallic oxide; and a conductive adhesive composition comprising a binder and conductive particles having a number average particle size of from 1 nm to 3000 nm.

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