The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2005
Filed:
Feb. 21, 2002
Hiroshi Okabe, Kokubunji, JP;
Hirozi Yamada, Tsukui, JP;
Eriko Takeda, Tokyo, JP;
Kazunori Yamamoto, Tsukuba, JP;
Hiroyuki Kuriya, Shimodate, JP;
Masanori Yamaguchi, Tsukuba, JP;
Kazuhisa Otsuka, Shimodate, JP;
Yoshitaka Hirata, Shimodate, JP;
Yasushi Shimada, Tsukuba, JP;
Hiroshi Okabe, Kokubunji, JP;
Hirozi Yamada, Tsukui, JP;
Eriko Takeda, Tokyo, JP;
Kazunori Yamamoto, Tsukuba, JP;
Hiroyuki Kuriya, Shimodate, JP;
Masanori Yamaguchi, Tsukuba, JP;
Kazuhisa Otsuka, Shimodate, JP;
Yoshitaka Hirata, Shimodate, JP;
Yasushi Shimada, Tsukuba, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi Chemical Co., Ltd., Tokyo, JP;
Abstract
The present invention provides a manufacturing method of an electronic circuit device including a multi-layer circuit board incorporated with a thin film capacitor small in size and of high performance capable of attaining higher capacitance value with a thin dielectric film of high dielectric constant and with favorable film quality. A first electrode layer and a thin film dielectric layer are laminated continuously in this order in one identical to laminate each of the layers on a leveled substrate in one identical chamber and then the first electrode layer is fabricated a conductor pattern.