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Shimodate, Japan

Hiroyuki Kuriya

USPTO Granted Patents = 13 (Patent Applications = 2)

Average Co-Inventor Count = 6.5

ph-index = 8

Forward Citations = 290(Granted Patents)

Location History:

Chikusei, JP (2010)
Shimodate, JP (1994 - 2012)

Company Filing History:

13 out of 1,641

Hitachi Chemical Company, Ltd.

1 out of 42,508

where one patent can have more than one assignee

Years Active: 1994-2012

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13 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8119737 - Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device (2012-02-21),

2. 7947779 - Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer (2011-05-24),

3. 7700185 - Insulation material, film, circuit board and method of producing them (2010-04-20),

4. 7592250 - Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device (2009-09-22),

5. 7239013 - Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device (2007-07-03),

6. 7070670 - Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device (2006-07-04),

7. 6889431 - Manufacturing method of electronic circuit including multilayer circuit board (2005-05-10),

8. 6838170 - Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same (2005-01-04),

9. 6673441 - Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same (2004-01-06),

10. 6621170 - Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film (2003-09-16),

11. 6265782 - Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film (2001-07-24),

12. 5449480 - Method of producing boards for printed wiring (1995-09-12),

13. 5319005 - Epoxy resin molding material for sealing of electronic component (1994-06-07),

Title: Pioneer of Adhesive Innovations: The Inventor Hiroyuki Kuriya

Introduction: Hiroyuki Kuriya, a distinguished inventor hailing from Shimodate, JP, is a visionary in the realm of adhesive compositions and semiconductor devices. With a commendable portfolio of 13 patents under his belt, Kuriya's work has significantly impacted the technological landscape.

Latest Patents: Kuriya's latest patents showcase his expertise in adhesive compositions for semiconductor applications. He has developed cutting-edge solutions that include epoxy resins, curing agents, and polymer compounds to enhance semiconductor device performance and reliability.

Career Highlights: Throughout his career, Hiroyuki Kuriya has made substantial contributions to companies such as Hitachi Chemical Company, Ltd. and Hitachi, Ltd. His innovative approach to adhesive technologies has propelled the industry forward, earning him recognition as a leader in the field.

Collaborations: Kuriya has collaborated with esteemed professionals in the industry, including Yasushi Shimada and Kazunori Yamamoto. Together, they have worked on groundbreaking projects that have revolutionized the way adhesive materials are utilized in semiconductor devices.

Conclusion: In conclusion, Hiroyuki Kuriya stands as a beacon of innovation, with a remarkable track record of pioneering inventions that have reshaped the technological landscape. His dedication to pushing the boundaries of what is possible continues to inspire future generations of inventors and innovators.

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