The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2012
Filed:
Apr. 12, 2011
Teiichi Inada, Tsukuba, JP;
Keiji Sumiya, Hitachinaka, JP;
Takeo Tomiyama, Tsukuba, JP;
Tetsurou Iwakura, Tsukuba, JP;
Hiroyuki Kawakami, Tsukuba, JP;
Masao Suzuki, Tsukuba, JP;
Takayuki Matsuzaki, Ichihara, JP;
Youichi Hosokawa, Ichihara, JP;
Keiichi Hatakeyama, Tsukuba, JP;
Yasushi Shimada, Tsukuba, JP;
Yuuko Tanaka, Shimotsuma, JP;
Hiroyuki Kuriya, Shimodate, JP;
Teiichi Inada, Tsukuba, JP;
Keiji Sumiya, Hitachinaka, JP;
Takeo Tomiyama, Tsukuba, JP;
Tetsurou Iwakura, Tsukuba, JP;
Hiroyuki Kawakami, Tsukuba, JP;
Masao Suzuki, Tsukuba, JP;
Takayuki Matsuzaki, Ichihara, JP;
Youichi Hosokawa, Ichihara, JP;
Keiichi Hatakeyama, Tsukuba, JP;
Yasushi Shimada, Tsukuba, JP;
Yuuko Tanaka, Shimotsuma, JP;
Hiroyuki Kuriya, Shimodate, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor.