Ichihara, Japan

Takayuki Matsuzaki

This inventor holds 18 USPTO granted patents, primarily in Semiconductor Manufacturing. Top assignees: Hitachi Chemical Company, Ltd., The Furukawa Electric Co., Ltd.. Active years: 2006-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takayuki Matsuzaki. Retrieved from https://idiyas.com/inventor/takayuki-matsuzaki

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 88.9

Average Co-Inventor Count = 7.3

ph-index = 9

Forward Citations = 208(Granted Patents)


Company Filing History:


Years Active: 2006-2017

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Areas of Expertise:
Adhesive Tape
Wafer Processing
Semiconductor Device
Dicing Method
Adhesive Composition
Manufacturing Method
Die Bonding
Adhesive Film
18 patents (USPTO):Explore Patents

Title: Takayuki Matsuzaki: Innovator in Semiconductor Manufacturing

Introduction

Takayuki Matsuzaki is a prominent inventor based in Ichihara, Japan. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 18 patents. His innovative work has advanced the technology used in wafer processing, showcasing his expertise and dedication to the industry.

Latest Patents

One of Matsuzaki's latest patents involves a flap in an adhesive tape specifically designed for semiconductor manufacturing. This patent details a method for manufacturing a tape for processing wafers. The design includes circular or tongue-shaped notched parts that face the center of an adhesive layer. These notched parts correspond to a pasting region on a wafer ring, reaching a release substrate from the side of a base material film. The formation of these notched parts allows for a unique peeling mechanism. When a peeling force is applied, the outer portions of the tacky material layer and the base material film are peeled off first, while the inner portion remains attached to the wafer ring. This design increases the peeling strength between the wafer processing tape and the wafer ring, preventing premature peeling during processing.

Career Highlights

Throughout his career, Matsuzaki has worked with notable companies, including Hitachi Chemical Company, Ltd. and The Furukawa Electric Co., Ltd. His experience in these organizations has contributed to his extensive knowledge and expertise in semiconductor technologies.

Collaborations

Matsuzaki has collaborated with several talented individuals in his field, including Michio Mashino and Shinya Katou. These collaborations have fostered innovation and have led to advancements in semiconductor manufacturing techniques.

Conclusion

Takayuki Matsuzaki is a distinguished inventor whose work in semiconductor manufacturing has resulted in numerous patents and innovations. His contributions continue to shape the industry and enhance the efficiency of wafer processing technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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