The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2015
Filed:
Oct. 14, 2011
Kouhei Taniguchi, Ichihara, JP;
Takayuki Matsuzaki, Ichihara, JP;
Shinya Katou, Ichihara, JP;
Kouji Komorida, Ichihara, JP;
Michio Mashino, Ichihara, JP;
Tatsuya Sakuta, Ichihara, JP;
Rie Katou, Ichihara, JP;
Kouhei Taniguchi, Ichihara, JP;
Takayuki Matsuzaki, Ichihara, JP;
Shinya Katou, Ichihara, JP;
Kouji Komorida, Ichihara, JP;
Michio Mashino, Ichihara, JP;
Tatsuya Sakuta, Ichihara, JP;
Rie Katou, Ichihara, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release base material from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased. Methods of manufacturing the tape and a semiconductor device are also provided.