Introduction: Michio Mashino is a prominent inventor based in Ichihara, Japan, known for his significant contributions in the realm of semiconductor technology. With a total of 19 patents to his name, his work has greatly influenced advancements in this critical field.

Latest Patents: Among his latest innovations are the "Adhesive Sheet for Semiconductor" and the "Dicing Tape Integrated Adhesive Sheet for Semiconductor." These innovative sheets are designed to exhibit excellent cuttability when processed into individual pieces and provide exceptional embeddability into the irregularities of wiring boards. The adhesive sheet includes a unique resin composition comprising a high-molecular-weight component and a filler, with a breaking elongation of 40% or less at 0°C before curing. After curing, the elastic modulus of the adhesive is notable, ranging from 0.1 to 10 MPa at 175°C.

Career Highlights: Michio Mashino is currently employed at Hitachi Chemical Company, Ltd., where he has been instrumental in developing cutting-edge adhesive technologies for semiconductor manufacturing. His deep understanding and practical application of materials science have earned him recognition within the industry.

Collaborations: Throughout his career, Mashino has collaborated with talented individuals like Takayuki Matsuzaki and Kouhei Taniguchi, contributing to innovative projects and enhancing the company’s technological repertoire.

Conclusion: Michio Mashino’s impactful work in semiconductor technology through his numerous patents demonstrates the crucial role of innovation in advancing the industry. His contributions continue to pave the way for improved manufacturing processes and enhanced product capabilities, making him a valuable asset in the field of electronics.

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