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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9969909 B1

PDFFull Text
Date of Patent:
May. 15, 2018

Filed:

Nov. 07, 2008

Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor

Applicants:

Masaki Yamada, Ichihara, JP;

Michio Mashino, Ichihara, JP;

Inventors:

Masaki Yamada, Ichihara, JP;

Michio Mashino, Ichihara, JP;

Assignee:

HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, LLP

Primary Examiner:

Victor S Chang

Int. Cl.
CPC ...
C09J 11/04 (2006.01); C09J 7/00 (2018.01); C09J 133/08 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); C08L 9/00 (2006.01); C08L 13/00 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
C09J 11/04 (2013.01); C09J 7/00 (2013.01); C09J 133/08 (2013.01); H01L 21/6836 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); C08K 3/013 (2018.01); C08L 9/00 (2013.01); C08L 13/00 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2409/00 (2013.01); H01L 21/67132 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83191 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01045 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/181 (2013.01); H01L 2924/351 (2013.01); Y10T 428/2852 (2015.01);
Abstract

There is provided an adhesive sheet for a semiconductor and a dicing tape integrated adhesive sheet for a semiconductor that are each good in cuttability when the sheets are each cut into individual pieces by expansion and are each good in embeddability into irregularities in a wiring board when the sheets are each molded thereto. An adhesive sheet for a semiconductor includes a resin composition containing a high-molecular-weight component and a filler, the breaking elongation of the adhesive sheet before curing is 40% or less at 0° C., and the elastic modulus of the adhesive sheet after curing is from 0.1 to 10 MPa at 175° C.

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