Hitachi Chemical Company, Ltd.

The Furukawa Electric Co., Ltd.

Takayuki Matsuzaki

Michio Mashino

Tatsuya Sakuta

Shinya Katou

Kouji Komorida

Rie Katou

Kouhei Taniguchi

Teiichi Inada

Michio Uruno

Keiichi Hatakeyama

Masao Suzuki

Keiji Sumiya

Yasushi Shimada

Hiroyuki Kuriya

Takeo Tomiyama

Tetsurou Iwakura

Ryoji Furutani

Yuuko Tanaka

Hiroyuki Kawakami

Youichi Hosokawa

Maiko Tanaka

Masaaki Yasuda

Shinichi Ishiwata

Yasumasa Morishima

Masaya Nishiyama

Kenji Kita

Yuuji Hasegawa

Flap in an adhesive tape for semiconductor manufacturing

In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release substrate from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased and the wafer processing tape can be suppressed from being peeled off from the wafer ring during processes.

Tape for processing wafer, method for manufacturing tape for processing

Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor device

In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release base material from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased. Methods of manufacturing the tape and a semiconductor device are also provided.

Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor device

A dicing/die bonding integral film of the present invention includes a base film, a pressure-sensitive adhesive layer which is formed on the base film and to which a wafer ring for blade dicing is bonded, and a bonding layer formed on the adhesive layer and having a central portion to which a semiconductor wafer to be diced is bonded, wherein a planar shape of the bonding layer is circular, an area of the bonding layer is greater than an area of the semiconductor wafer and smaller than an area of each of the base film and the adhesive layer, and a diameter of the bonding layer is greater than a diameter of the semiconductor wafer and less than an inner diameter of the wafer ring, and a difference in diameter between the bonding layer and the semiconductor wafer is greater than 20 mm and less than 35 mm.

Dicing/die bonding integral film, dicing/die bonding integral film manufacturing method, and semiconductor chip manufacturing method

Adhesive tape for semiconductor manufacturing

An adhesive sheet comprising a release substrate, a substrate film, and a first tacky-adhesive layerplaced between the release substrateand the substrate film, wherein an annular incision D is formed on the release substratefrom the surface of the first tacky-adhesive layerside, the first tacky-adhesive layeris laminated so as to cover the whole inner surface of the incision D in the release substrate, and the incision D has a depth d of less than the thickness of the release substrateand 25 &#x3bc;m or less.

Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device

Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor.

Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device

Growing community of inventors

Ichihara, Japan

Takayuki Matsuzaki