The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 1995
Filed:
Apr. 14, 1993
Applicant:
Inventors:
Hiroyuki Kuriya, Shimodate, JP;
Shinsuke Hagiwara, Shimodate, JP;
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
264112 ; 264261 ; 2642711 ; 26427217 ; 26432818 ;
Abstract
A method of producing a board for printed wiring comprising disposing a metal foil in a plate-shape cavity of a mold so that the metal foil is in contact with at least one internal side of the cavity, injecting a molding material comprising an epoxy resin, a hardening agent and a powdery inorganic filler into the cavity and curing the epoxy resin, the molding material containing 50 to 90% by volume of the powdery inorganic filler based on the total of the molding material.