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Chikusei, Japan

Shinsuke Hagiwara

USPTO Granted Patents = 20

Average Co-Inventor Count = 4.1

ph-index = 10

Forward Citations = 695(Granted Patents)

Location History:

Shimodate-shi, Ibaraki-ken, JP (2004)
Shimodate, JP (1993 - 2009)
Ibaraki, JP (2011)
Chikusei, JP (2008 - 2012)

Company Filing History:

19 out of 1,641

Hitachi Chemical Company, Ltd.

Wacker-chemie Gmbh

1 out of 832,891

Other

patents

where one patent can have more than one assignee

Years Active: 1993-2012

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20 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8232355 - Liquid resin composition for electronic components and electronic component device (2012-07-31),

2. 7982322 - Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the same (2011-07-19),

3. 7981977 - Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler (2011-07-19),

4. 7544727 - Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate (2009-06-09),

5. 7397139 - Epoxy resin molding material for sealing use and semiconductor device (2008-07-08),

6. 7187072 - Fabrication process of semiconductor package and semiconductor package (2007-03-06),

7. 6746897 - Fabrication process of semiconductor package and semiconductor package (2004-06-08),

8. 6713589 - Phenyl, naphthly or fluorene cyclopentyl epoxy resins (2004-03-30),

9. 6365432 - Fabrication process of semiconductor package and semiconductor package (2002-04-02),

10. 6329492 - Phenyl, naphthyl or fluorene cyclopentyl epoxy resins (2001-12-11),

11. 6235842 - Phase-separated carboxyl group-containing elastomer modified phoenoxy resin optionally with epoxy resin (2001-05-22),

12. 6207789 - Phenolic resin, resin composition, molding material for encapsulation, and electronic component device (2001-03-27),

13. 5976912 - Fabrication process of semiconductor package and semiconductor package (1999-11-02),

14. 5962139 - Semiconductor sealant of epoxy resin and organic polymer-grafted (1999-10-05),

15. 5739217 - Epoxy resin molding for sealing electronic parts containing organic (1998-04-14),

Sure, I can help you with that. Here is the article about inventor Shinsuke Hagiwara:

Title: Shinsuke Hagiwara: A Visionary Inventor in the Global Tech Community

Introduction:

Shinsuke Hagiwara's passion for innovation and relentless pursuit of excellence have solidified his reputation as a visionary inventor in the global tech community. His contributions continue to inspire future generations of inventors to push the boundaries of what is possible in the world of technology.

Latest Patents:

Shinsuke Hagiwara holds a total of 20 patents. His latest patents include:

1. "Liquid resin composition for electronic components and electronic component device" - A composition that excels in migration resistance, formability, and reliability.

2. "Sealant for electronics of epoxy resin, aromatic amine, accelerator, and inorganic filler" - A composition used in sealing electronic components, known for its excellent fluidity, adhesiveness, and high reliability.

Career Highlights:

Shinsuke Hagiwara has made significant contributions while working at companies such as Hitachi Chemical Company, Ltd. and Wacker-Chemie GmbH. His innovative spirit and expertise have been instrumental in developing cutting-edge technologies in the field of electronic components.

Collaborations:

Throughout his career, Shinsuke Hagiwara has collaborated with talented individuals such as Haruaki Sue and Naoki Fukutomi. Together, they have worked on groundbreaking projects that have advanced the field of electronic components.

Conclusion:

In conclusion, Shinsuke Hagiwara's dedication to innovation and his remarkable inventions have left a lasting impact on the global tech community. His work continues to shape the future of technology, inspiring inventors worldwide to strive for excellence and push the boundaries of what is possible.

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