The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 1999
Filed:
Jan. 29, 1998
Applicant:
Inventors:
Shinsuke Hagiwara, Shimodate, JP;
Hiroyuki Saitoh, Tsukuba, JP;
Hiroki Sashima, Shimodate, JP;
Peter Huber, Burghausen, DE;
Bernward Deubzer, Burghausen, DE;
Michael Geck, Burghausen, DE;
Assignees:
Hitachi Chemical Co., Ltd., Tokyo, JP;
Wacker-Chemie GmbH, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ; C08L / ;
U.S. Cl.
CPC ...
428413 ; 428416 ; 428901 ; 525476 ; 525902 ;
Abstract
An epoxy resin molding material comprising an epoxy resin, a phenolic resin and a powder flexibilizer which has a core-shell structure composed of a solid silicone core and an organic polymer shell is an epoxy resin molding material for sealing electronic parts.
Hagiwara, Shinsuke. (1999). Semiconductor sealant of epoxy resin and organic polymer-grafted (U.S. Patent No. 5962139). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5962139
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile