The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2004
Filed:
Nov. 09, 2001
Applicant:
Inventors:
Haruaki Sue, Tsukuba, JP;
Shinsuke Hagiwara, Shimodate, JP;
Fumio Furusawa, Yuki, JP;
Seiichi Akagi, Ibaraki-ken, JP;
Akihiro Kobayashi, Ichihara, JP;
Hideki Yokoyama, Ichihara, JP;
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07D / ; C08G 5/906 ;
U.S. Cl.
CPC ...
C07D / ; C08G 5/906 ;
Abstract
This invention provides a compound suitable as an encapsulating material for electronic devices and having a high Tg, low moisture-absorption, high adhesion and fluidity which is a cyclopentylene compound represented by Formula (I) and its intermediate cyclopentenyl compound represented by Formula (III). In the formula, m is 0 or more, Ar and Ar are each a phenol residual group, a naphthol residual group or a fluorene derivative residual group, and each contain a hydroxyl group or a glycidyloxyl group.