The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2008
Filed:
Apr. 07, 2004
Ryoichi Ikezawa, Tsukuba, JP;
Naoki Nara, Tochigi, JP;
Hideyuki Chaki, Oyama, JP;
Yoshihiro Mizukami, Chikusei, JP;
Yoshinori Endou, Chikusei, JP;
Takaki Kashihara, Oyama, JP;
Fumio Furusawa, Yuki, JP;
Masaki Yoshii, Yokohama, JP;
Shinsuke Hagiwara, Chikusei, JP;
Mitsuo Katayose, Tsukuba, JP;
Ryoichi Ikezawa, Tsukuba, JP;
Naoki Nara, Tochigi, JP;
Hideyuki Chaki, Oyama, JP;
Yoshihiro Mizukami, Chikusei, JP;
Yoshinori Endou, Chikusei, JP;
Takaki Kashihara, Oyama, JP;
Fumio Furusawa, Yuki, JP;
Masaki Yoshii, Yokohama, JP;
Shinsuke Hagiwara, Chikusei, JP;
Mitsuo Katayose, Tsukuba, JP;
Hitachi Chemical Co., Ltd., Tokyo, JP;
Abstract
An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 μm or less and a specific surface area of 3.0 m/g or more.