Oyama, Japan

Hideyuki Chaki


Average Co-Inventor Count = 10.0

ph-index = 1

Forward Citations = 21(Granted Patents)


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: The Innovations of Hideyuki Chaki

Introduction

Hideyuki Chaki is a notable inventor based in Oyama, Japan. He has made significant contributions to the field of materials science, particularly in the development of epoxy resin molding materials. His work is essential for advancements in semiconductor technology.

Latest Patents

Chaki holds a patent for an encapsulating epoxy resin molding material designed for sealing use in semiconductor devices. This innovative material comprises an epoxy resin, a curing agent, and an inorganic filler. The inorganic filler has an average particle size of 12 µm or less and a specific surface area of 3.0 m/g or more, which enhances the performance of semiconductor devices.

Career Highlights

Hideyuki Chaki is associated with Hitachi Chemical Company, Ltd., where he has been instrumental in research and development. His expertise in epoxy resin technology has positioned him as a key player in the industry.

Collaborations

Chaki has worked alongside talented colleagues such as Ryoichi Ikezawa and Naoki Nara. Their collaborative efforts have contributed to the advancement of innovative materials in the semiconductor sector.

Conclusion

Hideyuki Chaki's contributions to epoxy resin technology and semiconductor materials highlight his importance as an inventor. His work continues to influence the industry and drive innovation forward.

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