Ryoichi Ikezawa

Title: Ryoichi Ikezawa: Innovator in Epoxy Resin Technology

Introduction

Ryoichi Ikezawa is a prominent inventor based in Tsukuba, Japan. He has made significant contributions to the field of epoxy resin technology, holding a total of 4 patents. His work focuses on developing advanced materials for electronic components, enhancing their performance and reliability.

Latest Patents

Ikezawa's latest patents include innovative formulations for epoxy resin molding materials. One of his notable inventions is an epoxy resin molding material for sealing, which comprises an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and specific silane compounds. This formulation is designed to improve the sealing properties of electronic components. Another significant patent is for an encapsulant that combines epoxy resin, a curing agent, and a silane coupling agent with a secondary amino group or phosphate. This encapsulating material is particularly effective for thin semiconductor devices, ensuring excellent fluidity and minimizing defects during the molding process.

Career Highlights

Ryoichi Ikezawa is associated with Hitachi Chemical Company, Ltd., where he has been instrumental in advancing epoxy resin technologies. His work has not only contributed to the company's product offerings but has also had a substantial impact on the electronics industry.

Collaborations

Ikezawa has collaborated with notable colleagues such as Shinsuke Hagiwara and Fumio Furusawa. These partnerships have fostered innovation and have led to the successful development of new materials and technologies.

Conclusion

Ryoichi Ikezawa's contributions to epoxy resin technology exemplify his commitment to innovation in the electronics field. His patents reflect a deep understanding of material science and its applications in modern technology.