Hitachi Chemical Company, Ltd.

Ryoichi Ikezawa

Shinsuke Hagiwara

Fumio Furusawa

Mitsuo Katayose

Ken Nanaumi

Mitsuyoshi Hamada

Masaki Yoshii

Toshihisa Kumakura

Masanobu Fujii

Naoki Nara

Keizo Takemiya

Takaki Kashihara

Yoshinori Endou

Hideki Eriguchi

Hideyuki Chaki

Toru Baba

Yoshihiro Mizukami

An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.

Epoxy resin molding material for sealing and electronic component device

An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein. The encapsulating epoxy resin molding material for thin semiconductor devices according to this invention is excellent in fluidity, and the semiconductor device encapsulated therein, which is a semiconductor device having a semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or on a mounted substrate such as organic substrate or organic film, is free of molding defects such as wire sweep, voids etc. as shown in the Examples, and thus its industrial value is significant.

Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate

An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 &#x3bc;m or less and a specific surface area of 3.0 m/g or more.

Epoxy resin molding material for sealing use and semiconductor device

An adhesive composition for metal-clad laminates which comprises:

Adhesive composition for metal-clad laminates

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Tsukuba, Japan

Ryoichi Ikezawa