The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2020
Filed:
Jan. 12, 2017
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Mitsuyoshi Hamada, Tsukuba, JP;
Fumio Furusawa, Tsukuba, JP;
Ryoichi Ikezawa, Tsukuba, JP;
Keizo Takemiya, Yuki, JP;
Toru Baba, Yuki, JP;
Assignee:
HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 7/18 (2006.01); H01L 23/29 (2006.01); C08G 59/06 (2006.01); C08G 59/68 (2006.01); C08L 63/00 (2006.01); C08G 59/62 (2006.01); C08G 59/08 (2006.01); C09K 3/10 (2006.01); C08K 3/36 (2006.01);
U.S. Cl.
CPC ...
C08K 7/18 (2013.01); C08G 59/063 (2013.01); C08G 59/08 (2013.01); C08G 59/621 (2013.01); C08G 59/688 (2013.01); C08L 63/00 (2013.01); C09K 3/1006 (2013.01); H01L 23/296 (2013.01); C08K 3/36 (2013.01); C08K 2201/005 (2013.01); C08K 2201/006 (2013.01); C09K 2003/1078 (2013.01); H01L 2924/0002 (2013.01);
Abstract
An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.