This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Hitachi Chemical Company, Ltd.. Active years: 2002-2020.
Location History:
- Ibaraki-ken, JP (2002)
- Yuki, JP (2020)
Company Filing History:
Years Active: 2002-2020
Title: Keizo Takemiya: Innovator in Epoxy Resin Technology
Introduction
Keizo Takemiya is a prominent inventor based in Yuki, Japan. He has made significant contributions to the field of epoxy resin technology, holding a total of 2 patents. His work focuses on developing advanced materials for electronic components, showcasing his expertise and innovative spirit.
Latest Patents
Takemiya's latest patents include an epoxy resin molding material for sealing and an encapsulant epoxy resin composition for electronic devices. The first patent describes a molding material that consists of an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and specific silane compounds. The second patent presents an encapsulant epoxy resin composition that includes an epoxy resin, a curing agent, non-conductive carbon, and an inorganic filler, aimed at enhancing the performance of electronic devices.
Career Highlights
Keizo Takemiya is associated with Hitachi Chemical Company, Ltd., where he has been instrumental in advancing epoxy resin technologies. His work has not only contributed to the company's portfolio but has also impacted the broader electronics industry.
Collaborations
Throughout his career, Takemiya has collaborated with notable colleagues, including Hidenori Abe and Mitsuyoshi Hamada. These collaborations have fostered innovation and have led to the development of cutting-edge materials in the field.
Conclusion
Keizo Takemiya's contributions to epoxy resin technology exemplify his dedication to innovation and excellence. His patents reflect a commitment to enhancing electronic components, making him a key figure in the industry.