The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2004
Filed:
Nov. 29, 2001
Yuko Tanaka, Shimotsuma, JP;
Yasushi Shimada, Tsukuba, JP;
Teiichi Inada, Tsukuba, JP;
Hiroyuki Kuriya, Shimodate, JP;
Kazunori Yamamoto, Tsukuba, JP;
Yasushi Kumashiro, Shimodate, JP;
Keiji Sumiya, Hitachinaka, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
An adhesive which comprises (1) 100 parts by weight of an epoxy resin and a hardener therefor, (2) 75 to 300 parts by weight of an epoxidized acrylic copolymer having a glycidyl (meth)acrylate unit content of 0.5 to 6 wt. %, a glass transition temperature of −10° C. or higher and a weight average molecular weight of 100,000 or more and (3) 0.1 to 20 parts by weight of a latent curing accelerator; an adhesive member having a layer of the adhesive; an interconnecting substrate for semiconductor mounting having the adhesive member; and a semiconductor device containing the same.