The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2006
Filed:
Mar. 30, 2001
Takeo Tomiyama, Tsukuba, JP;
Teiichi Inada, Tsukuba, JP;
Masaaki Yasuda, Tsukuba, JP;
Keiichi Hatakeyama, Tsukuba, JP;
Yuuji Hasegawa, Tsukuba, JP;
Masaya Nishiyama, Tsukuba, JP;
Takayuki Matsuzaki, Ichihara, JP;
Michio Uruno, Chiba, JP;
Masao Suzuki, Tsukuba, JP;
Tetsurou Iwakura, Tsukuba, JP;
Yasushi Shimada, Tsukuba, JP;
Yuuko Tanaka, Shimotsuma, JP;
Hiroyuki Kuriya, Shimodate, JP;
Keiji Sumiya, Hitachinaka, JP;
Takeo Tomiyama, Tsukuba, JP;
Teiichi Inada, Tsukuba, JP;
Masaaki Yasuda, Tsukuba, JP;
Keiichi Hatakeyama, Tsukuba, JP;
Yuuji Hasegawa, Tsukuba, JP;
Masaya Nishiyama, Tsukuba, JP;
Takayuki Matsuzaki, Ichihara, JP;
Michio Uruno, Chiba, JP;
Masao Suzuki, Tsukuba, JP;
Tetsurou Iwakura, Tsukuba, JP;
Yasushi Shimada, Tsukuba, JP;
Yuuko Tanaka, Shimotsuma, JP;
Hiroyuki Kuriya, Shimodate, JP;
Keiji Sumiya, Hitachinaka, JP;
Hitachi Chemical Co., Ltd., Tokyo, JP;
Abstract
There are disclosed an adhesive composition comprising: (a) an epoxy resin, (b) a curing agent and (c) a polymer compound with a weight average molecular weight of 100,000 or more, wherein a ratio of A/B exceeds 1 and is 10 or less, where A represents the total weight of (a) the epoxy resin and (b) the curing agent and B represents a weight of (c) the polymer compound; an adhesive composition, whose compositions are separated into a sea phase and an island phase, when viewed at a section in a cured state, and a ratio X/Y is in a range of 0.1 to 1.0, where X is an area of the sea phase and Y is an area of the island phase; a process for producing said adhesive composition; an adhesive film wherein said adhesive composition is formed into a film form; an adhesive film for bonding a semiconductor chip and a wiring board for mounting a semiconductor or for bonding semiconductor chips themselves, wherein the adhesive film can perform bonding by heat-pressing with a pressure of 0.01 to 0.5 MPa; a wiring board for mounting a semiconductor equipped with said adhesive film on a surface for mounting a semiconductor chip; and a semiconductor device using said adhesive film or said wiring board for mounting a semiconductor.