The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2007
Filed:
May. 30, 2003
Yasushi Shimada, Tsukuba, JP;
Yoshitaka Hirata, Shimodate, JP;
Hiroyuki Kuriya, Shimodate, JP;
Kazuhisa Otsuka, Shimodate, JP;
Masanori Yamaguchi, Tsukuba, JP;
Yuichi Shimayama, Shimodate, JP;
Ken Madarame, Yuki, JP;
Etsuo Mizushima, Yuki, JP;
Yuusuke Kondou, Shimodate, JP;
Kazunori Yamamoto, Tsukuba, JP;
Yasushi Shimada, Tsukuba, JP;
Yoshitaka Hirata, Shimodate, JP;
Hiroyuki Kuriya, Shimodate, JP;
Kazuhisa Otsuka, Shimodate, JP;
Masanori Yamaguchi, Tsukuba, JP;
Yuichi Shimayama, Shimodate, JP;
Ken Madarame, Yuki, JP;
Etsuo Mizushima, Yuki, JP;
Yuusuke Kondou, Shimodate, JP;
Kazunori Yamamoto, Tsukuba, JP;
Hitachi Chemical Co., Ltd., Tokyo, JP;
Abstract
A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a radio electronic device mounting the semiconductor device.