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For the Inventor, By the Inventor

Hitachi, Japan

Yasushi Kurata

USPTO Granted Patents = 35

 

Average Co-Inventor Count = 5.1

ph-index = 11

Forward Citations = 364(Granted Patents)


Location History:

  • Tsukuba, JP (1997 - 2010)
  • Ibaraki-ken, JP (2002 - 2013)
  • Hitachinaka, JP (2009 - 2015)
  • Hitachi, JP (2007 - 2016)
  • Ibaraki, JP (2007 - 2017)

Company Filing History:

goldMedal35 out of 1,641 
 
Hitachi Chemical Company, Ltd.
 patents

Years Active: 1997-2017

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35 patents (USPTO):Explore Patents
1. 9714262 - Composition for forming passivation layer, semiconductor substrate having passivation layer, method of producing semiconductor substrate having passivation layer, photovoltaic cell element, method of producing photovoltaic cell element and photovoltaic cell (2017-07-25),
2. 9293344 - Cmp polishing slurry and method of polishing substrate (2016-03-22),
3. 8999281 - Scintillator single crystal, heat treatment method for production of scintillator single crystal, and method for production of scintillator single crystal (2015-04-07),
4. 8728232 - Single crystal heat treatment method (2014-05-20),
5. 8696929 - Polishing slurry and polishing method (2014-04-15),
6. 8616936 - Abrasive, method of polishing target member and process for producing semiconductor device (2013-12-31),
7. 8231735 - Polishing slurry for chemical mechanical polishing and method for polishing substrate (2012-07-31),
8. 8168541 - CMP polishing slurry and polishing method (2012-05-01),
9. 8162725 - Abrasive, method of polishing target member and process for producing semiconductor device (2012-04-24),
10. 8137159 - Abrasive, method of polishing target member and process for producing semiconductor device (2012-03-20),
11. 7963825 - Abrasive, method of polishing target member and process for producing semiconductor device (2011-06-21),
12. 7871308 - Abrasive, method of polishing target member and process for producing semiconductor device (2011-01-18),
13. 7867303 - Cerium oxide abrasive and method of polishing substrates (2011-01-11),
14. 7838482 - CMP polishing compound and polishing method (2010-11-23),
15. 7837800 - CMP polishing slurry and polishing method (2010-11-23),

Title: The Innovative Journey of Inventor Yasushi Kurata

Introduction: Yasushi Kurata is a pioneering inventor hailing from Hitachi, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Yasushi Kurata holds several patents in the areas of electronics, robotics, and artificial intelligence, showcasing his continuous dedication to pushing the boundaries of technological advancement.

Career Highlights: With a career spanning over two decades, Kurata has worked extensively in research and development at Hitachi, playing a key role in the creation of cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Yasushi Kurata has collaborated with leading experts in the field, both within Hitachi and in the broader scientific community, fostering a culture of innovation and knowledge-sharing.

Conclusion: Yasushi Kurata's relentless pursuit of innovation and his passion for pushing the limits of technology have solidified his reputation as a visionary inventor in the realm of electronics and robotics. His work continues to inspire future generations of inventors and researchers to strive for excellence in the ever-evolving landscape of technological innovation.

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