The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2016
Filed:
Jul. 20, 2005
Masato Fukasawa, Hitachi, JP;
Naoyuki Koyama, Hitachi, JP;
Yasushi Kurata, Hitachi, JP;
Kouji Haga, Hitachi, JP;
Toshiaki Akutsu, Hitachi, JP;
Yuuto Ootsuki, Hitachi, JP;
Masato Fukasawa, Hitachi, JP;
Naoyuki Koyama, Hitachi, JP;
Yasushi Kurata, Hitachi, JP;
Kouji Haga, Hitachi, JP;
Toshiaki Akutsu, Hitachi, JP;
Yuuto Ootsuki, Hitachi, JP;
HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;
Abstract
The present invention relates to a CMP polishing slurry comprising cerium oxide particles, a dispersant, a water-soluble polymer and water, wherein the water-soluble polymer is a polymer obtained in polymerization of a monomer containing at least one of a carboxylic acid having an unsaturated double bond and the salt thereof by using at least one of a cationic azo compound and the salt thereof as a polymerization initiator. The present invention provides a polishing slurry and a polishing method allowing polishing efficiently uniformly at high speed without scratch and also allowing easy process management in the CMP technology of smoothening an interlayer dielectric film, BPSG film, and insulation film for shallow trench isolation.