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For the Inventor, By the Inventor

Hitachi, Japan

Kouji Haga

USPTO Granted Patents = 12

Average Co-Inventor Count = 4.9

ph-index = 4

Forward Citations = 90(Granted Patents)


Location History:

  • Hitachi, JP (2007 - 2016)
  • Ibaraki, JP (2018)

Company Filing History:

goldMedal12 out of 1,641 
 
Hitachi Chemical Company, Ltd.
 patents

Years Active: 2007-2018

where 'Filed Patents' based on already Granted Patents

12 patents (USPTO):
1. 10037894 - Polishing liquid for metal and polishing method (2018-07-31),
2. 9293344 - Cmp polishing slurry and method of polishing substrate (2016-03-22),
3. 8900335 - CMP polishing slurry and method of polishing substrate (2014-12-02),
4. 8734204 - Polishing solution for metal films and polishing method using the same (2014-05-27),
5. 8501625 - Polishing liquid for metal film and polishing method (2013-08-06),
6. 8231735 - Polishing slurry for chemical mechanical polishing and method for polishing substrate (2012-07-31),
7. 8168541 - CMP polishing slurry and polishing method (2012-05-01),
8. 8002860 - CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive (2011-08-23),
9. 7838482 - CMP polishing compound and polishing method (2010-11-23),
10. 7837800 - CMP polishing slurry and polishing method (2010-11-23),
11. 7410409 - Abrasive compound for CMP, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive compound (2008-08-12),
12. 7311855 - Polishing slurry for chemical mechanical polishing and method for polishing substrate (2007-12-25),

Title: Kouji Haga: Innovator in Metal Polishing Technologies

Introduction

Kouji Haga is a prominent inventor based in Hitachi, Japan, known for his significant contributions to the field of metal polishing technologies. With a total of 12 patents to his name, Haga has developed innovative solutions that enhance the efficiency and reliability of metal polishing processes.

Latest Patents

Haga's latest patents include a metal polishing liquid designed for polishing metal substrates. This invention features a unique formulation comprising a metal solubilizer containing amino acids, benzotriazole compounds, and an acrylic acid polymer. The innovative mass ratio between the components allows for high polishing rates while minimizing etching, resulting in more reliable embedded patterns. Another notable patent is a CMP polishing slurry that includes cerium oxide particles, a dispersant, and a water-soluble polymer. This invention enables efficient and uniform polishing at high speeds without causing scratches, facilitating better process management in CMP technology.

Career Highlights

Kouji Haga is associated with Hitachi Chemical Company, Ltd., where he has made significant strides in developing advanced polishing technologies. His work has been instrumental in improving the quality and efficiency of metal polishing processes, which are critical in various industrial applications.

Collaborations

Haga has collaborated with notable colleagues such as Masato Fukasawa and Naoyuki Koyama, contributing to the advancement of polishing technologies through teamwork and shared expertise.

Conclusion

Kouji Haga's innovative contributions to metal polishing technologies have established him as a key figure in the field. His patents reflect a commitment to enhancing efficiency and reliability in industrial processes.

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