The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2014
Filed:
Apr. 27, 2010
Masato Fukasawa, Hitachi, JP;
Naoyuki Koyama, Hitachi, JP;
Kouji Haga, Hitachi, JP;
Toshiaki Akutsu, Hitachi, JP;
Masato Fukasawa, Hitachi, JP;
Naoyuki Koyama, Hitachi, JP;
Kouji Haga, Hitachi, JP;
Toshiaki Akutsu, Hitachi, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
A CMP polishing slurry of the present invention contains cerium oxide particles, water, and a polymer of at least one of a methacrylic acid and the salt thereof, and/or a polymer of at least one of a methacrylic acid and the salt thereof and a monomer having an unsaturated double bond, preferably contains furthermore a dispersant or a polymer of monomers containing at least one of an acrylic acid and the salt thereof. The present invention provides a CMP polishing slurry and a polishing method that, after polishing, give a polished film having a smaller difference in residual film thickness due to a pattern density difference.