Hitachi, Japan

Toshiaki Akutsu

This inventor holds 14 USPTO granted patents and 5 published patent applications, primarily in CMP Polishing Technology. Top assignees: Hitachi Chemical Company, Ltd., Showa Denko Materials Co., Ltd.. Active years: 2014-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Toshiaki Akutsu. Retrieved from https://idiyas.com/inventor/toshiaki-akutsu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 14 

% Patents Active = 100.0

Average Co-Inventor Count = 4.1

ph-index = 4

Forward Citations = 28(Granted Patents)


Location History:

  • Hitachi, JP (2014 - 2020)
  • Tokyo, JP (2018 - 2021)

Company Filing History:


Years Active: 2014-2021

Loading Chart...
Areas of Expertise:
Polishing Liquid
Abrasive
CMP Polishing Slurry
Polishing Method
Substrate Polishing
Polishing Agent
Slurry Set
Substrate Abrading
Polishing Solution
Polishing Set
14 patents (USPTO):Explore Patents

Title: Toshiaki Akutsu: Innovator in Polishing Technologies

Introduction

Toshiaki Akutsu, based in Hitachi, Japan, is a notable inventor who has significantly contributed to the field of polishing technologies. With a total of 14 patents to his name, Akutsu has demonstrated a deep commitment to innovation in materials and methods that enhance the efficiency and effectiveness of polishing processes.

Latest Patents

Among Toshiaki Akutsu's latest patents are several groundbreaking innovations in polishing liquids and methods. One such patent details a polishing liquid that consists of a liquid medium, abrasive grain, and a polymer. The polymer features a first molecular chain directly bonded to a functional group, alongside a second molecular chain that branches from it. The functional groups involved include carboxyl, hydroxyl, sulfo, and sulfonic acid salt groups, which contribute to the unique properties of the polishing liquid.

Additionally, another significant invention is a polishing agent that comprises a fluid medium and an abrasive grain containing a hydroxide of a tetravalent metal element. This patent also includes a composition of multiple additives, such as compounds with a polyoxyalkylene chain and vinyl alcohol polymers, cationic polymers, and amino group-containing sulfonic acid compounds. These advancements highlight Akutsu's inventiveness in creating practical solutions for substrate polishing.

Career Highlights

Toshiaki Akutsu's professional history includes impactful roles at prominent companies. He has contributed his expertise at Hitachi Chemical Company, Ltd. and Showa Denko Materials Co., Ltd., where he has played an essential role in the development of new materials and technologies. His work in these organizations has been fundamental to his innovations in polishing methods.

Collaborations

Throughout his career, Akutsu has collaborated with talented colleagues, including Hisataka Minami and Tomohiro Iwano. Their collective efforts have been pivotal in pushing the boundaries of polishing technology and advancing the industry through their innovations.

Conclusion

With 14 patents to his credit, Toshiaki Akutsu stands as a significant figure in the world of polishing technologies. His innovative contributions continue to influence both materials science and the methods used in various applications, showcasing the importance of collaboration and ingenuity in driving technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…