The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2018
Filed:
Apr. 28, 2014
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Munehiro Oota, Tokyo, JP;
Toshio Takizawa, Tokyo, JP;
Hisataka Minami, Tokyo, JP;
Toshiaki Akutsu, Tokyo, JP;
Tomohiro Iwano, Tokyo, JP;
Assignee:
HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 (2006.01); B24B 37/04 (2012.01); C09G 1/02 (2006.01); H01L 21/3105 (2006.01); C09K 3/14 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 37/044 (2013.01); C09K 3/1409 (2013.01); C09K 3/1463 (2013.01); H01L 21/31053 (2013.01); H01L 21/76229 (2013.01);
Abstract
A polishing liquid for CMP, comprising: an abrasive grain including a cerium-based compound; a 4-pyrone-based compound; a polymer compound having an aromatic ring and a polyoxyalkylene chain; a cationic polymer; and water.
Quick Actions:
Oota, Munehiro. (2018). Polishing liquid for cmp, and polishing method (U.S. Patent No. 10155886). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10155886
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile